ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,860, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package on package structure with enc... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,861, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Memory on package (MOP) architecture" was invented by Eng Huat Go... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,862, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Zigzag wired memory module" was invented by Jo... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,863, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Microelectronic assemblies including stacked dies coupled by a th... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,864, issued on Nov. 3, was assigned to Altera Corp. (San Jose, Calif.). "Grid-based interconnect system for modular integrated circuit syste... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,865, issued on Nov. 3, was assigned to NEPES LAWEH Corp. (Cheongju-si, South Korea) and NEPES HAYYIM (Binan, Philippines). "Semiconductor pa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,866, issued on Nov. 3, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Semiconductor package" was invented by ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,867, issued on Nov. 3, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Chip structure and chip preparation method" was inv... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,868, issued on Nov. 3, was assigned to MediaTek Inc. (Hsinchu City, Taiwan). "Semiconductor package assembly" was invented by Shih-Yi Syu (H... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,869, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Package architecture with memory chips having different process r... Read More